- Used for automatic transfer of wafer products in semiconductor production line. Effectively improve equipment utilization, production efficiency and product yield
ITEM
SPECIALIFICATION
Cleanliness
Class 100-1000
Temperature
23±2℃
Humidity
45±5%
Vibration
≤0.5G
Load
10Kg
Control mode
Auto /manual/Teaching
FOUP SIZE
300MM FOUP
Noise
≤80DB
Straight speed
Max：3m/s
Turning speed
Max：0.6m/s
HOIST up/down speed
Max：1.8m/s
Acceleration
1.5m/s²
Deceleration
2m/s²
LOAD time
15s
Climbing
3°（10M）
Positioning accuracy of NODE points
±1mm
Turning radius
R=500MM
Location recognition
BCR
Control mode
Auto/manual/teaching
ESD
surface resistivity 10e7~10e8Ω
Top
Open/closed
PC
2 sets (hot standby)
UPS
1 set (can send signal to the host. SCS computer automatically shut down after power failure)
Communication
PIO E84-0301 E84-1107； PIO E84-0301 E84-1107; Network communication
No. 28 Heshun Road, Suzhou Industrial Park, China 
+86 13451983657 
sales@passioniot.com 